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Производитель печатных плат IC Substrate

Производитель подложек для пакетов MIS

Что такое субстрат для пакета MIS? Производитель подложек для пакетов MIS,НЕ (Формованная межблочная подложка) package substrate is a sophisticated solution for compact and high-performance electronic assemblies. This substrate integrates both circuitry and mechanical structures into a single molded component, reducing the need for additional layers and connectors. MIS substrates offer excellent electrical performance, механическая стабильность, and thermal management. They are commonly used…